Suppliers
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Semtech
Semtech is a leading supplier of high performance analog and mixed-signal semiconductors and advanced algorithms. Semtech focus areas are:
Cellular IoT Solutions
Leading edge-to-Cloud solutions delivering the device, software and connectivity services needed to simplify and accelerate data-driven transformation with cellular IoT.LoRa Wireless RF
LoRa®, a long range, low power platform, and the de facto wireless platform of Internet of Things, is highly integrated and cost-effective, boasting a notable battery life of up to 20 years, a 3-mile range in urban environments and a 30-mile range outdoors.
Circuit Protection
Sophisticated devices that protect sensitive circuitry from Electrostatic Discharge (ESD), Electrical Fast Transients (EFT), Cable Discharge Events (CDE), and other electrical overstress.
Signal Integrity
A comprehensive portfolio of innovative optical, analog and mixed-signal semiconductor solutions that serve the rising global demand for high-speed data transmission products.Professional AV
Advanced off-the-shelf technology that enables end-to-end systems and integrates advanced inline signal processing capabilities such as light compression, broadcast quality scaling and audio down-mixing.PerSe® Smart Sensing
Ultra-low power, feature-rich touch controllers that are optimized for numerous applications and provide best-in-class sensitivity with robust noise immunity to enhance touch and near range proximity detection.
Broadcast Video
Award-winning solutions designed specifically to push real-world broadcast boundaries in performance, reach, power, and signal integrity while reducing time to market and design risks. Also provides solutions to switch and resize single multiple audio/video inputs from/to single/multiple outputs over ethernet without the need for a dedicated control box.Power Management
A pioneer in power management ICs across networking and industrial power, handheld power and automotive applications, Semtech leads the quest to enable a new class of greener, smarter and smaller end products.
Link to Semtech
For more information specially on LoRa
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For more information, please contact:
DK: Søren Manicus & Rune Domsten
SE, NO: Patrik Särenfors
FI & Baltics: Santtu Korpinen
GB & IR: Duncan BennettCentral Europe: Matthias Spahn & Willi Bolz
Ignion
Ignion, headquartered in Barcelona, designs, manufactures, and commercializes miniature, off-the-shelf antennas for IoT, mobile connectivity, and short-range wireless devices. Founded in 2015 as an independent antenna product business, Ignion emerged from the main Fractus operation, combining a respected R&D team with proven manufacturing capabilities to bring a new generation of antenna products to market.
Their Virtual Antenna® technology offers adaptable, multiband antenna components that can be embedded in devices, allowing communication through various network connectivities, including 5G, Wi-Fi, and low-power wide-area networks. This approach simplifies antenna integration, enabling the same component to be used across different form factors and frequency bands.
Ignion’s product lineup includes the mXTEND™ series, such as NANO, ONE, DUO, TRIO, ALL, RUN, and OMNIA, covering operating ranges from 400 MHz to 10.6 GHz. These antennas cater to applications in smart metering, asset tracking, automotive telematics, and more.
To assist manufacturers in integrating their antenna technology, Ignion provides resources like engineering support, application notes, FAQs, webinars, whitepapers, design guides, and case studies. Their AI-powered platform, Oxion™, further streamlines the antenna design process.
Link to Ignion
Link for 24h Fast Track Antenna design service: Click here
For more information, please contact:
DK: Søren Manicus & Rune Domsten
SE, NO: Patrik Särenfors
FI & Baltics: Santtu Korpinen
GB & IR: Duncan Bennett
Winbond
Winbond is a 1B$+ Specialty Memory IC manufacturer from Taiwan with a 30-year history. Their portfolio includes both FLASH and DRAM and can offer the entire need for memory solutions in many applications.
The products fit very well to the Nordic industry for 3 key reason:- Winbond offers long, lifetime support
- The Memory sizes are well suited for the industryal, IoT, Communication and Consumer applications in our territory
- Winbond have their own 12” fabs, and hence have full control of the complete production flow
The full control of manufacturing secures highest level of quality and includes support for KGD deliveries including SiP package bonding & power/thermal, DRAM simulation, wafer level on speed test etc.
Link to Winbond
For more information, please contact:
DK: Søren Manicus & Rune Domsten
SE, NO: Patrik Särenfors
FI & Baltics: Santtu Korpinen
GB & IR: Duncan Bennett
Nuvoton
Nuvoton is a sister company to the memory supplier Winbond who we have worked with for many years. Both Winbond and Nuvoton belong to the Taiwan based Walsin Group.
Nuvoton is a very well establish supplier of these technologies with full end-to-end support on all products. They are the fastest growing MCU supplier WW and ranked no 7 globally which may be a surprise to EU based customers, as this position is obtained primarily from activities in Asia and America.
The initial focus from the complete portfolio includes:
8 bit 8051 MCUs - link
ARM Cortex-M0 – link
ARM Cortex M23 – link
ARM Contex M4 – link
ARM Cortex M7 - link
ARM Contex A35 MPUs - link
ARM9 MPUs - link
Nuvoton Sound Processors NSP - link
All products are supported with tools available free of charge from the website and the technical expertise offered by the Indesmatech team.
We have NSP sound processing EVKs available if you want to test the technology.
Nuvoton’s wider portfolio includes products for applications in Power, Sensors and IoT solutions. We are obviously ready to support all products from the portfolio.
For more information, please contact:
DK: Søren Manicus & Rune Domsten
SE, NO: Patrik Särenfors
FI & Baltics: Santtu Korpinen
GB & IR: Duncan Bennett
Solid State Storage Technology Corporation (SSSTC)
SSSTC, a subsidiary of KIOXIA Corporation, stands as a global leader in designing, developing, and manufacturing digital storage solutions. Building on its extensive success in Optical Disk Drives, the company established its Solid-State Drive (SSD) Division in 2008 to meet the growing demands for data storage.
SSSTC leads the industry, offering innovative designs, high-quality, and efficient products across a range of interface specifications and external dimensions. Their comprehensive lineup of SSDs caters to Enterprise, Industrial, Business Client, and Consumer markets. These SSDs come in various form factors and interfaces, ensuring the right fit for each application.
The company’s SSDs are entirely developed in-house by dedicated R&D teams, allowing for highly customizable solutions, including firmware design. Through partnerships with industry-leading component suppliers, SSSTC delivers SSD solutions known for their quality, reliability, and commitment to innovation and manufacturing excellence.
For more information, please contact:
DK: Søren Manicus & Rune Domsten
SE, NO: Patrik Särenfors
FI & Baltics: Santtu Korpinen
GB & IR: Duncan Bennett
Central Europe: Matthias Spahn
Synaptics
Synaptics is a world leading provider of high-end audio solutions for digital headsets and voice-controlled devices.
Digital headset SoCs
Synaptics’ multi-tier headset product line features a wide range of audio codec solutions to meet the needs of various applications including USB Type-C headsets, advanced wireless and 3D gaming headsets, as well as more compact Universal Communication (UC) office headsets. Our broad array of low-power, high-resolution multi-core hardware codecs and audio software technologies enable greater innovation and differentiation within the market, helping manufacturers develop new and exciting high-performance headsets, headphones, hearables and audio accessories.
AudioSmart Far-field voice DSPs
The future is now. Voice has become the most exciting interface for interacting with consumer electronics, from tiny wearables to large appliances. Driven by advancements for the smart home and more broadly consumer IoT, smart speakers, smart thermostats, and smart lighting are quickly advancing due to Audi-oSmart far-field voice technology. Throughout the voice revolution, Synaptics has been bolstering its industry-leading portfolio of advanced audio hardware and software solutions designed to help today’s always-listening voice-enabled devices hear and be heard better.
Link to Synaptics
For more information, please contact:
Jens J. Tybo Jensen
TDK InvenSense
TDK InvenSense is a world leading provider of MEMS motion sensors and MEMS microphones.
MEMS microphones
InvenSense’s analog and digital microphone portfolios build on a strong heritage of industry firsts, including continuous improvement of MEMS microphone SNR, ever-higher integration levels, and even lower power consumption. Technological advances like these have enabled machine speech recognition & adaptive noise suppression to become commonplace in consumer devices and other applications.
Humans intuitively understand audio capture to be a critical factor in awareness of their sur-roundings. InvenSense is working to enable the same level of awareness for smart devices with leading-edge MEMS microphones. InvenSense combines the capability to sense audio along with cutting-edge motion detection, which is important for many contextual awareness applications.
MEMS motion sensors
InvenSense was the first company to deliver Motion Interface solutions with fully integrated sensors and robust MotionFusion™ firmware algorithms. Our MotionTracking™ devices enable our customers to integrate Motion Interface capability directly into devices, easily and with minimal development cost and effort. InvenSense is a pioneer and leader in our industry, con-sistently delivering game changing solutions.
We began with the world’s first dual-axis MEMS gyroscopes in 2006 for the digital still camera market, the world’s first integrated 3-axis motion processing solution for smart phones in 2009, the world’s first single-chip integrated 6-axis MotionTracking™ device in 2010, the world’s first integrated 9-axis MotionTracking™ device in 2012; and in 2014, the ICM-20728, the world’s first integrated 7-axis (3-axis gyroscope + 3-axis accelerometer + pressure sensor) single-chip platform solution with onboard Digital Motion Processor (DMP™).
Motion- and gesture-based devices from InvenSense are rapidly becoming a key function in many consumer electronic devices including mobile, wearable, Smart Home, and automotive and industryal devices. Our motion solutions, including gyroscopes, accelerometers, compasses and pressure sensors, detect and track an object’s motion in three-dimensional space, allow-ing consumers to interact with their electronic devices by tracking motion in free space and delivering these motions as input commands.
Link to TDK-InvenSense
For more information, please contact:
Jens J. Tybo Jensen
Aconeer
Acconeer is a semiconductor company specializing in the development of ultra-low power, high-precision 60 GHz radar sensors. These sensors, measuring only 5×5 mm, can detect distance, speed, and motion of multiple objects up to 20 meters away. Their compact size and low power consumption make them ideal for applications in consumer electronics, robotics, IoT, healthcare, automotive, and industrial sectors.
Founded in 2012 and based in Malmö, Sweden, Acconeer’s vision is to be the world leader in small-size, low-cost, and low-power consumption mmWave radar sensing for innovation and sustainability. Acconeer has shipped over 1 million sensors to more than 60 countries, and their radar technology has been integrated into various products, including robots from global consumer electronics companies.
Acconeer collaborates with a global network of distribution partners and has manufacturing partnerships with various companies, enabling scalable production to meet high-volume demands.
Through continuous innovation and a focus on sustainability, Acconeer aims to revolutionize the sensor technology landscape, providing innovative solutions for a wide range of industries.
Link to Acconeer
For more information, please contact:
Gert Jørgensen
Melexis
Melexis is a Belgian semiconductor company that creates innovative microelectronic solutions for a better, more connected world. With over 35 years of experience, Melexis has grown from a small startup into a global enterprise, employing nearly 2.000 people across 18 countries and representing over 50 nationalities.
Focusing on the automotive industry and expanding into alternative mobility, smart appliances, smart buildings, robotics, energy management, and digital health, Melexis delivers high qullity sensor and driver ICs. Their portfolio includes magnetic position sensors, optical sensors, pressure and temperature sensors, and embedded motor drivers. Melexis offers 18 chips specifically designed for cars, serving both powertrain and chassis-body-safety applications.
The company’s strategy centers on innovation, leadership in sensing and driving solutions, and growth in non-automotive markets. This approach is guided by a set of core values: caring for people and the planet, strategic planning, understanding the value of resources, and embracing the journey toward success.
With a strong emphasis on R&D and a commitment to “inspired engineering,” Melexis continues to develop technologies that enhance safety, efficiency, and sustainability across industries, striving to shape the best imaginable future.
Link to Melexis
For more information, please contact:
Andreas Sternberg
xMEMS
xMEMS Labs is a semiconductor company based in Santa Clara, California, specializing in the development of solid-state, monolithic MEMS speakers. These speakers are designed to deliver consistent performance, compact size, energy efficiency, and uniformity, distinguishing them from traditional voice coil or hybrid MEMS approaches.
xMEMS offers a range of MEMS micro speakers, including Cowell and Montara Plus, for use in TWS earbuds, IEMs, hearing aids, and other compact audio devices. The Cypress speaker uses ultrasonic modulation to deliver over 140 dB SPL at low frequencies, making it a strong alternative to traditional speakers in noise-canceling earbuds.
The 1mm-thin Sycamore speaker is designed for smartwatches, AR/VR headsets, and other space-constrained devices, enabling slimmer designs without sacrificing audio quality. xMEMS also provides reference designs like Harding TWS and Montara Plus IEMs to help manufacturers integrate their speaker technology more efficiently.
With a growing portfolio of patents and a focus on solid-state audio solutions, xMEMS Labs is contributing to advancements in personal audio technology.
For more information, please contact:
Soundskrit
Soundskrit's product lineup features both analog and digital directional MEMS microphones which can replace conventional multi-microphone beamforming arrays with a single chip, enabling product designers to improve performance, decrease power consumption, and facilitate easier integration into smaller product form factors.
When used in combination with traditional omni-directional microphones, the Soundskrit two-port directional microphones can reduce the computational effort requirements for dynamic beamforming/audio zoom while maintaining high SNR to effectively distinguish speech from background noise. This capability ensures that the speaker's voice remains clear, even in crowded and noisy settings.
Further enhanced by Soundskrit’s SimplyDSP and SimplyAI software, features such as adjustable beamforming, voice activity detection, off-axis muting, automatic gain control, dynamic noise suppression, de-reverberation, and Direction-of-arrival (DOA) estimation further distinguishes the solutions.
These innovations makes the Soundskrit MEMS microphones ideal for a varaiety of applications including Headsets, TWS Earbuds, Webcams, Security Cameras, Smartspeakers, AR/VR Headsets, Laptops, Tablets, TVs and Conferencing Systems.
For more information, please contact:
EnSilica
EnSilica stands at the forefront of fabless chip manufacturing, specializing in tailor-made ASICs for OEMs and system houses. Additionally, the company offers IC design services, catering to enterprises equipped with their own design teams. Renowned for its world-class proficiency, EnSilica excels in delivering custom RF, mmWave, mixed-signal, and digital ASICs to a diverse clientele spanning the automotive, industrial, healthcare, and communications sectors on a global scale.
EnSilica's comprehensive suite of core IP encompasses cryptography, radar, and communication systems. The company boasts a proven track record of providing high-quality solutions that align with extraordinary industry standards.
Listed below are some core services provided by EnSilica:
- Feasibility and choice of technology
- Specification phase
- ASIC design system and details
- ASIC layout
- Tape out and foundry interface
- Prototype delivery
- Validation of silicon
- Qualification and ramp to production
- Volume delivery and inventory management
- Field return analysis
For more than 20 years, EnSilica has gained solid experience servicing a wide group of companies ranging from start-ups to well established system houses. Over the years, a high number of projects has proven succesful within key areas of custom solutions. EnSilica’s project catalogue spans from module design with embedded software to the development of hadware platforms, including high complex multi-million gate system-on-chip architectures. EnSilica equals high quality and exquisite eye for bringing state of the art ideas to life.
Headquartered near Oxford, UK, EnSilica extends its design centres across the UK, India, and Brazil.
For more information, please contact:
Global Unichip Corporation (GUC)
In the world of advanced ASIC services, GUC sits on top as a market leader, publicly traded on the Taiwan Stock Exchange (TWSE). GUC also takes advantage of its strategic alliance with Taiwan Semiconductor Manufacturing Co. (TSMC), who has a 35% stake in the company. This collaboration helps GUC overcome challenges with technology access for ASIC development and manufacturing. The close ties with TSMC give GUC access to semiconductor processes, from 2nm CMOS and up.
GUC's design services span every phase of the process, including "Spec-in" and SoC (System-on-Chip) integration, physical implementation, advanced packaging technologies (APT) such as CoWoS, turnkey manufacturing, and the incorporation of leading technologies like HBM (High-Bandwidth Memory) and Die-to-Die Interconnect IPs. GUC’s APT system ensures integrated, discrete chips in one package, with ultra-computation power and optimized efficiency.
With a technology range extending from 2nm and up and a track record of over 250 tape-outs, GUC is well-positioned in the market. TSMC supplements this position by offering automotive qualified processes, broadening the useability of GUC's offerings to demanding tasks like autonomous driving. Additionally, GUC supports larger structure widths for ASIC implementation, providing diverse requirements in industrial, telecommunications, networks, and consumer applications.
GUC is for people seeking:
- Advanced ASIC technology for IP
- Addressing processor-intensive tasks in hardware
- Implementing custom System-in-Package solutions
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