Custom Solutions - ASIC
Independent Design Houses and ASIC suppliers used for the Choice of Technology
Indesmatech cooperates with independent design houses in the Europe area to create customized solutions for chips and modules. This can be done under our supervision to benefit from the experiences from previous designs. We can also “set the team” across ASIC suppliers and IDHs with our internal resources. Together, we can facilitate the optimal R&D process to obtain and secure “faster time to market”.
Below are mentioned some key drivers for considering custom-made microelectronic solutions:
- Reduce BOM
- Increase Performance
- Lower Power Consumption
- Add Functionality
- Enhance Security
- Smaller Size & Weight
- Improve IP Protection
- Improve Yields
- Reduce Test and Assembly Costs
- Improve Reliability
Our ASIC suppliers, EnSilica and GUC, develop and deliver custom chips in technologies from 2nm and up to 180nm. This, combined with different transistor types, creates possibilities for ultra-low-power CMOS solutions, combined with high voltage BCD technology used within battery management applications and MEMs controllers.
Our portfolio includes FPGAs, digital, analog, mixed-signal, and RF-solutions from DC and up to 7GHz. Our partners intend to make device deliveries interfaced directly to fit your production capabilities. This enables us to deliver both wafer and T&R chips, as well as packed components in different applications, with optimal solutions like CSP, QFN, or BGA.
During the last couple of years, our partners have taped out more than 20 custom chips within the Automotive, Industrial IoT, and Healthcare industries.
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