NEWS UPDATE

Latest news from our industry scene

AI

JANUARY 2022

Embedded AI - DIREC

Embedded AI will revert the current AI processing flow from collecting data at the edge and processing it at the cloud, to a flow where AI algorithms are migrated from the cloud to a distributed network of AI enabled edge-devices, which will increase responsiveness and functionality, reduced data transfer, and increased resilience, security, and privacy.
direc.dk 

AUGUST 2021

The Things Conference visits EOT

 - have you seen the program?

Electronics of Tomorrow is the first post Corona face to face event with exhibition, Conference and Workshops

It is held by MCH on Aug 31 to Sept 2.
Indesmatech has been involved in setting up the Conference program that includes many interesting topics around 5G, AI Data & Cloud, Software, Supply Chain, Security, Green Innovation and IoT.

EOT will be hosting “The Things Conference on Tour” as the first visit to the Nordics region. This Conference program will give you strong insights on LoRaWAN topics like:
• Introduction to new Semtech solutions both on Chip and Cloud level
• New LoRaWAN standards update by LoRa Alliance
• Introduction to Helium
• The business models around LoRaWAN
• LoRaWAN in Space

During the event you will also have the possibility to meet the speakers for individual conversations.

Please let us know for any specific interests and we can organize it.

JUNE 2021

NEWS FROM MELEXIS

Melexis announces latest Triaxis® Position Sensor together with new PCB-less packages

MLX90377 supports more output signal formats while a new Single Mold Package (SMP) improves PCB-less integration and manufacturing costs

Tessenderlo, Belgium, 27th May 2021 - Melexis, a global microelectronics engineering company, has introduced the MLX90377 single- and dual-die (fully redundant) Triaxis position sensor for automotive and industrial applications together with a new PCB-less package for position sensors.

The MLX90377 is a magnetic rotary and linear position sensor IC, which builds on the success of the MLX90371 and MLX90372 Triaxis sensors. Based on the Triaxis Hall magnetic front-end, it integrates an ADC with signal conditioning, DSP and an output stage driver that now supports SPC (Short PWM Code) as well as ratiometric analog, PWM, and SENT signal formats. Like other members of the Triaxis position sensor range, it can be used in rotary and linear motion position sensing applications. With its stray field robust modes, ASIL-C (single die) capability, and external pin measurement it is ideally suited for high performance and safety critical applications.

The new package options comprise the SMP-3 and SMP-4 (single mold package, 3- and 4-pin) for PCB-less designs. Like Melexis’ first PCB-less package, the DMP-4 released in 2012, these new packages are intended to be used without a printed circuit board thereby reducing total system cost and improving mechanical integration and reliability. These new package outlines are smaller than the existing DMP-4 package and offer better mechanical integration and quality via optimization of the package body and electrical leads, representing nearly a decade of continuous improvement based on customer feedback and application knowledge. The SMP-3 is a single die solution and will first be supported by the MLX90377 while the SMP-4 provides a dual die solution (shared power and ground pins) and will first be supported by the previously launched MLX90371.

“Melexis is constantly improving and expanding its product offering, by using its domain expertise to develop new solutions,” said Nick Czarnecki, Marketing Manager, Melexis. “The MLX90377 provides improved performance and adds SPC capability, which is now being used in multi-bus architectures such as those found in advanced steering and braking applications. The new package options are perfect examples of how Melexis listens to customers and works with its partners to improve quality and reduce costs.”

About Melexis
Combining a passion for technology with truly inspired engineering, Melexis designs, develops and delivers innovative micro-electronic solutions that enable designers to turn ideas into applications that support the best imaginable future. The company’s advanced mixed-signal semiconductor sensor and actuator components address the challenges of integrating sensing, driving and communication into next-generation products and systems that improve safety, raise efficiency, support sustainability and enhance comfort.

Melexis is a world leader in automotive semiconductor sensors. Today, on average, every new car produced worldwide contains 13 Melexis chips. Melexis has used its core experience to expand its portfolio of sensors and driver ICs. Now they also meet the needs of smart appliances, home automation, industrial and medical applications. Melexis sensing solutions include magnetic sensors, MEMS sensors (pressure, TPMS, infrared), sensor interface ICs, optoelectronic single point and linear array sensors and Time of Flight. The company’s driver IC portfolio incorporates advanced DC & BLDC motor controllers, LED drivers and FET pre-driver ICs, while Melexis has the know-how and expertise to build bridges between components, allowing them to communicate in a clear and fast way.

Melexis is headquartered in Belgium and employs over 1,500 people in 18 locations worldwide. The company is publicly traded on Euronext Brussels (MELE).

Contact Melexis:
Elcke Vercruysse

Marketing Communications Manager

Transportstraat 1.
3980 Tessenderlo
Belgium
Tel: +32 13 67 95 15
eve@melexis.com

MARCH 2021

Our team of 12 people need 2 more members

We are looking for additional Business Development Managers in Sweden and Finland on Electronics components.

Focus will be on IoT, Sensors, Memory and Embedded Computing. Candidates should preferably have an engineering background and experiences in sales and/or technical support within the semiconductor industry. You will work with key customers and support projects with a system level approach including all potential partners from our ecosystem. We are flexible on geographical locations.

Interested? Give us a call on +45 4078 0412

SEPTEMBER 2020

LoRaWAN Gateway no. 1000 delivered by Indesmatech

IoT network role out based on LoRaWAN is escalating in 2020 – both on Public and Private deployments.

Indesmatech has now shipped more than 1000 Gateways – this is truly a milestone and shows the success rate on the technology. 2 key partners are Cibicom in Denmark and Netmore in Sweden. Both partners offer nationwide networks and are hosting a professional LoRaWAN Network server.

Cibicom offers nationwide outdoor coverage on LoRaWAN in Denmark, and Netmore will cover more than 110-120 municipalities and 70% of Sweden’s population by year end.
Both companies are also offering hosting of privately owned Gateways complementing the coverage and giving local deep indoor coverage.

Martin Løbel, CEO from Cibicom, and Fredrik Skoglund, Head of Sales at Netmore, receives Gateway delivery number 1000 at the Indesmatech office in Lyngby, Denmark, surrounded by gateways for the next volume shipment.

Semtech and Amazon Collaborate to Provide Low Power Connectivity for Consumer Applications on Amazon Sidewalk READ MORE

Join Semtech, MultiTech and Orange for a new in-depth webinar on how 5G will change the industry and the role LoRaWAN®-based solutions will play in this industry shift.

In this webinar, Semtech, MultiTech and Orange will address key questions including:
What are the advantages of LoRa® devices and the LoRaWAN protocol for IoT applications?

What exactly do industry experts mean when referring to 5G networking?

How do LoRa devices and LoRaWAN networks fill the gaps left by 5G, specifically in key vertical markets?

What makes LoRaWAN ideal for massive IoT use cases, and what are its advantages over other networking protocols?

How are today’s leading operators deploying LoRaWAN?

What are some examples of use cases for LoRa devices and the LoRaWAN protocol to complement 5G networks?

The webinar:
5G Fact vs. Fiction, and How LoRaWAN® Plays a Role will take place Monday, April 20, 2020 at 11:00 AM ET (5:00 PM CET)

Speakers:
Daniel Quant, Vice President of Strategic Development, MultiTech
Ronan Le Bras, Head of Technical Strategy for Wireless Networks and IoT, Orange
Remi Lorrain, Director of LoRaWAN Networks, Semtech

Moderator:
Robin Duke-Woolley, CEO, Beecham Research

Register closed

2.4GHz LoRa/LoRaWAN on its way

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New LoRa based system chip from Semtech for Tracking applications - indoor and outdoor.

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